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INVESTIGATION ON FORMATION OF OHMIC CONTACT OF ALUMINIUM SOLDER TO N⁺ TYPE SILICONONUKI J; SOENO K.1981; J. JAP. INST. MET.; JPN; DA. 1981-08; VOL. 45; NO 8; PP. 841-846; BIBL. 8 REF.Article

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Indium-copper multilayer composites for fluxless oxidation-free bondingCHEN, Y.-C; LEE, C. C.Thin solid films. 1996, Vol 283, Num 1-2, pp 243-246, issn 0040-6090Article

Assessment of fluxless solderability with reference to three tin-based soldersJACOBSON, D. M; HUMPSTON, G.GEC journal of research. 1990, Vol 8, Num 1, pp 21-31, issn 0264-9187Article

Analysis of Fluxless, Reactive Brazing of Al Alloys Using Differential Scanning CalorimetryCORBIN, Stephen Francis; WINKLER, Sooky; TURRIFF, Dennis R et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2014, Vol 45, Num 9, pp 3907-3915, issn 1073-5623, 9 p.Article

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Application of diffusion brazing to the bonding of metals and alloysWINIOWSKI, A.Welding international. 1999, Vol 13, Num 11, pp 870-874, issn 0950-7116Article

Evolution du traitement thermique en four sous vide = Evolution of heat treatments in vacuum furnacesLUC, J. P.1984, Vol 4, pp 15-21, issn 0249-8715Article

Lead-Less Chip assembly technology for low-cost MCMs : Special issue on high-density packaging technologyDOHYA, A; BONKOHARA, M; TANAKA, K et al.NEC research & development. 1998, Vol 39, Num 3, pp 203-210, issn 0547-051XArticle

A study on the fluxless soldering of Si-wafer/glass substrate using Sn-3.5 mass%Ag and Sn-37 mass%Pb solder : Special issue on basic science and advanced technology of lead-free electronics packagingPARK, Chang-Bae; HONG, Soon-Min; JUNG, Jae-Pil et al.Materials transactions - JIM. 2001, Vol 42, Num 5, pp 820-824, issn 0916-1821Article

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